Auction Bonding Curve
An Auction Bonding Curve refers to a pricing mechanism often used in decentralized finance (DeFi) and blockchain-based token sales to set or adjust the price of tokens dynamically based on demand. It combines elements of auction mechanics with a bonding curve, resulting in a hybrid approach to token distribution and pricing.
Imagine a token project launches with a bonding curve defined as P=S2P = S^2P=S2, where PPP is the price and SSS is the number of tokens sold:
The Auction Bonding Curve combines the demand-driven price discovery of auctions with the continuous and predictable price dynamics of bonding curves, making it a versatile tool in modern blockchain-based markets.